QYC Substrate Manufacturer

Why Choose Us

We specialize in manufacturing high-quality, multi-layer packaging substrates ranging from 2 layers to 20 layers. Our range of substrates includes High Frequency PCBs, High Speed PCBs, Ceramic PCBs, HDI PCBs, Rigid-Flex PCBs, Cavity PCBs, Metal PCBs, Teflon PCBs, Taconic PCBs, Isola PCBs, Package Substrates, Special PCBs, and packaging services.

When designing packaging substrates, if you have any doubts about the production process or are unsure if the factory can perfectly realize your design requirements, we are available for consultation and support. Please feel free to contact us via email, and our team of professional engineers will promptly respond. To ensure optimal execution and realization of your design, we work closely with designers to identify and address any process or technical issues that may arise.

With a team of over 200 professional engineers, we establish partnerships with approximately 100 to 200 new clients from around the world each month. Our clients discover us through online searches, while others are referred to us by satisfied long-term clients. The trust of our clients is earned not only because we consistently maintain stable, high-quality products but also because we utilize high-precision production machinery. We strictly adhere to customer specifications, using designated materials from specified brands to ensure that each product perfectly meets the expectations and requirements of our clients. Our commitment and focus are the key to maintaining consistent quality.

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About Us

We are a professional manufacturer of QYC substrates. To date, we have over 10,000 unique team members, and we continue to expand our specialized team and steadily grow. This not only demonstrates our industry strength but also heralds broader potential for future development.

We rely on advanced, high-precision production equipment from Japan to produce High Frequency PCBs, High Speed PCBs, Ceramic PCBs, HDI PCBs, Rigid-Flex PCBs, and more. This ensures the excellent quality of the packaging substrates we manufacture. Through these top-notch devices, we pledge to provide the most flawless product quality, maintaining stability and unmatched reliability for our customers.

Currently, we have produced a variety of 4 to 18-layer flip chip packaging substrates. Especially for complex flip chip packaging substrates, such as 14-layer ABF materials, we can ensure their quality with high efficiency in production. We take pride in our short production cycle of only 1 to 2 months, ensuring rapid delivery. Despite such a short production time, we never compromise on product quality—each substrate meets the highest manufacturing standards, showcasing our outstanding craftsmanship and technical prowess.

In terms of material selection for packaging substrates, we have multiple sources, including top suppliers from Japan, Korea, Taiwan, and China. Depending on the specific requirements of our customers, we carefully select and use the most suitable materials to manufacture substrates, ensuring that each product accurately meets customer expectations and standards.

QYC SUBSTRATE