기술

Presently, our company has the capability to manufacture a variety of high-density packaging substrates, ranging from 4 layers to 18 layers. We offer an extensive selection of substrate materials tailored for small pitch packaging or circuit boards. The minimum Bump pitch we support is 100um, while the minimum trace and spacing can reach as low as 9um/9um. Typically, our customers utilize trace and spacing in the range of 20um to 30um. It’s crucial to acknowledge that as the number of layers increases and trace and spacing diminish, our production costs rise accordingly. Conversely, larger trace and spacing with fewer layers can help mitigate production costs.

During the design phase, if you encounter any uncertainties or questions regarding design intricacies, please do not hesitate to reach out to us. We offer complimentary assistance to ensure that your design aligns with manufacturing requirements.

As all finalized design data remains confidential at this stage, we are unable to provide comprehensive design and production references. 그렇지만, we can furnish key data and information to enhance your understanding of our manufacturing capabilities and services.

Should you require additional information or have specific design prerequisites, please feel free to contact us. We are committed to delivering exceptional packaging substrate solutions tailored to your needs. We eagerly anticipate the opportunity to collaborate with you to accomplish your project objectives.